Our manufacturing process overview
01
Preparation
We prepare components, materials and documentation for production.
02
PCB Assembly
Automated and manual assembly of PCBs with precision and quality control.
03
Testing
Rigorous functional, quality testing to ensure reliability, performance.
04
Box Build
Final assembly, integration and packaging into finished products.
X-ray
AOI cannot evaluate the quality of soldered components like BGA, LGA, or CSP. Our X-ray inspection device performs further inspections on boards containing these components. Usually, an AOI specialist operates the X-ray machine. Not all PCB boards are tested since the X-ray process takes time. The estimated number of boards is examined depending on the project and partners needs.
In order to verify ideal reflow and process setup, our machine can inspect concealed solder junctions, check the selective soldering and rework, and perform failure analysis.
